TIMTEL Phase Change Thermal Interface Materials
Did you know that Streuter Technologies’ TIMTEL Phase Change Thermal Interface Materials product portfolio is among the broadest and most advanced in our industry?
TIMTEL Phase Change Thermal Interface Materials are available in a range of pad constructions and configurations to meet a range of electronic device applications. Phase change materials achieve an extremely low thermal resistance through the use of highly thixotropic compound coatings or films that are designed to flow and wetout the interface surfaces removing air from within the interface as well fill in surface imperfections and voids that may exist. During device operation, the compound changes from its solid state into a liquid state greatly improving thermal transfer from device to sink without worry of run-out or migration typically found in silicone based greases.
Phase Change Thermal Pad Features and Benefits:
Excellent replacement for thermal greases
Low surface resistance lead to excellent heat transfer
Drop in place pad solution - simple & clean installation
Multiple constructions (supported and unsupported)
Adjusts for flatness and voids upon flow
Highly thixotropic - prevents run-out
Silicone-free phase change compound designs
Non-dielectric and dielectric pad constructions
Available in a range of substrate coating and film thicknesses
Available in rolls, sheets, die cut invidiuals or die cut reels
